Standards |
Meets Fungus Resistant MIL-V-173C-2 |
|
Properties |
Color |
Clear Amber |
Specific
Gravity @ 21°C (70°F),
ASTM D-287 |
0.94 g/ml |
Viscosity, Dolph Viscosimeter
@ 30°C (86°F) |
44
- 55 sec. |
Viscosity,
#1 Demmler Cup @ 30°C (86°F) |
40
-50 sec. |
Build
Up, D.F.T., ASTM D-115 |
1.0
- 1.5 mils |
Thinner |
M.G
Chemicals Cat No. 435 |
Air Drying Time on Strip,
ASTM D-115-Set to Touch |
10 min. @ 20 °C |
Federal Specification,
TT-P-1436-Free of After Tack |
1 hour |
High Temperature Rating |
155°C |
Corrosive Effect on Copper |
None |
VOC Content, ASTM D 6053, lbs/gal
|
4.75 |
Service Temp. Range |
-40°C to 155°C (104°F to 311°F) |
Chemical
Resistance
|
Water |
Excellent |
Acid (10% Sulfuric Acid) |
Excellent |
Alkali
(1% Sodium Hydroxide) |
Excellent |
Salt Water |
Excellent |
Oil,
ASTM D-115 |
Passed |
Fungus
Resistance,, MIL-V-173-2
|
Aspergillus Niger |
Passed |
Aspergillus Flavus |
Passed |
Penicillium Funiculosum |
Passed |
Trichoderma
SP |
Passed |
Electrical Properties
|
Dielectric Strength, Volts/mil (dry) |
1800 |
Dielectric Strength, Volts/mil (wet)
|
1200 |
Full
cure |
24
hrs. @ 20°C (68°F)
60 min. @ 65°C (149°F) |
Thermal Class (UL-1446)
|
Twisted Pair (Magnet Wire MW28) |
130°C |