MG Thermal Cond. Epoxy Encapsulating & Potting Compound 1.0 lb
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MG Thermal Cond. Epoxy Encapsulating & Potting Compound 1.0 lb

Part number: MG-832TC-450ML
$45.49
Thermally Conductive Epoxy
Encapsulating & Potting Compound



100% solids. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.

  • Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
  • Two part epoxy, with a 1 to 1 mixing ratio by volume.
  • Two hour working time
  • Suitable for large production runs
  • Cures in 2 days at room temperature or one hour at 65°C.

    NOTE: THIS PRODUCT CANNOT BE SHIPPED BY AIR - IT MUST SHIP UPS GROUND ONLY
Specifications

Uncured Properties - Resin [Part A]
Viscosity   41,100 cps
Specific Gravity   1.8019
Color   Black
Uncured Properties - Hardener [Part B]
Viscosity   68,900 cps
Specific Gravity   1.5036
Color   Black
Cured Properties - PHYSICAL Test Method  
Mixed Viscosity   76,300 cps
Mixed Specific Gravity   1.6156
Volume Mix Ratio (resin:hardener)   1:1
Working time (100g)   120 min.
Cure Time (100g, room temp.)   48 hours
Heat Cure Time (100g, 65°C)   60 min.
Shore Hardness   82 Shore D
Tensile strength ASTM-D-638-02A 2734 psi
Elongation ASTM-D-638-02A 1.87 %
Compressive Strength ASTM-D-695-02A 4,088 psi
Flexural Strength ASTM-D-790-03 5,352 psi
Cantilever Beam (IZOD) Impact ASTM-D-256-02 E1 0.80 ft lb ft / in
Shear Strength ASTM-E-831-03 3.224 psi
Cured Properties - TEMPERATURE Test Method  
Constant Service Temperature   90°C (194°F)
Heat Deflection Temperature ASTM-D-648-01 35.35°C (95.6°F)
Dielectric Constant ASTM-D-150-98 4.41
Dissipation Factor ASTM-D-150-98 0.0113
Volume Resistivity ASTM-D-257-99 2.58 x 1015 ohm · cm
Surface Resistivity ASTM-D-257-99 3.16 x 1016 ohm · cm
Heat Deflection Temperature ASTM-D-648-01 35.35°C (95.6°F)
Intermediate Service Temp.   110°C (230°F)
Thermal Conductivity   0.682 W/m*K
Thermal Diffusivity   0.38 mm2/s
Volumetric Specific Heat   1.9MJ/m3*K
Thermal Expansion ASTM-E-831-03

148.3x10-6 mm/mm°C

Chemical and Solvent Resistance   Change after 3 days:
Hydrocloric Acid  
Isopropyl Alcohol   ~ 0%
Ethyl Lactate  
Acetone  
Xylene  
Iso hexanes   ~ 0%
Mineral spirits   ~ 0%

Product condition: New