MG Thermal Cond. Epoxy Encapsulating & Potting Compound 1.0 lbPart number: MG-832TC-450ML
Encapsulating & Potting Compound
100% solids. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.
- Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
- Two part epoxy, with a 1 to 1 mixing ratio by volume.
- Two hour working time
- Suitable for large production runs
in 2 days at room temperature or one hour at 65°C.
NOTE: THIS PRODUCT CANNOT BE SHIPPED BY AIR - IT MUST SHIP UPS GROUND ONLY