MG Part Number: 4860P-35G
Solder those tiny SMD components with ease using MG's 4860 Solder paste from Vetco Electronics. This solder paste comes in a 35g syringe and includes the syringe dispenser tip.
This is a No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of paste are non-conductive, noncorrosive and highly insulated. - no additional steps are required for post-soldering flux removal.
Features & Benefits:
- Low residues
- Easily dispensed
- Excellent wettability
- Hard non-conductive residues
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a dispensing application depends on viscosity, which can be altered by temperature change. If solder paste is purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.
Reusing Solder Paste:
This is not normally recommended, because it typically generates more problems than it is worth. If you do decide to reuse solder paste, these pointers may be helpful. This paste should be tightly sealed and refrigerated. Then, the paste may be reused at a later date, provided that the paste has not separated or thickened significantly compared to its original properties. Storage of syringes is preferred in an upright position with tip down to prevent flux separation and air entrapment.
|Shelf Life||Unopened container (30-50°F/2-10°C) – 6 Months
Unopened container (68-77°F/20-25°C) – 1 Months
Opened container (68-77°F/20-25°C) – 24 Hours
|Melting Point, °C||183 E|
|Coefficient of Thermal Expansion||24.7|
|Tensile Strength, psi||4442|
|Electrical Resistivity , (µohm- cm)||14.5|
|Electrical Conductivity, 104/ohm-cm||6.9|
|Yield Strength, psi||3950|
|Joint Shear Strength, at 0.1mm/min 20 °C||23|
|Joint Shear Strength, at 0.1mm/min 100 °C||14|
|Creep Strength, N/mm2 at 0.1mm/min 20 °C||3.3|
|Copper Mirror||No removal of copper film||IPC-TM-650 2.3.32|
|Bellcore (Telecordia)||4.10x1010ohms||Bellcore GR-78-CORE 13.1.3|
|Electromigration||Pass||Bellcore GR-78-CORE 13.1.4|
|Post Reflow Flux Residue||45%||TGA Analysis|
|Acid Value||110||IPC-TM-650 2.3.13|
|Metal Loading||88%||IPC-TM-650 2.2.20|
|Brookfield(1),kcps||400+/-10% kcps||IPC-TM-650 2.4.34 modified|
|Malcom(2),poise||850-1100||IPC-TM-650 220.127.116.11 modified|
|25 °C, 0.63 vertical/horizontal||No bridges all spacings||IPC-TM-650 2.4.35|
|150 °C, 0.63 vertical/horizontal||No bridges all spacings||IPC-TM-650 2.4.35|
|25 °C, 0.33 vertical/horizontal||0.20 /0.20||IPC-TM-650 2.4.35|
|150 °C, 0.33 vertical/horizontal||0.20/0.20||IPC-TM-650 2.4.35|
|Solder Ball Test||Pass||IPC-TM-650 2.4.43|
|Initial||85 gm||JIS Z 3284|
|Tack retention @ 24 hr||90 gm||JIS Z 3284|
|Tack retention @ 24 hr||82 gm||JIS Z 3284|
Best results have been achieved when MG 4860P is reflowed in a forced air convection oven with a minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top & bottom).
The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e. density, thickness, etc.) determine the actual reflow profile.
QTY: 1 x MG Sn63 / Pb37 Leaded Solder Paste - No Clean - 35g Syringe