Open 7 days a week.

{{ variant_title() }}

SKU: {{ variant_selected().sku }}

Purchasing options:


${{ ppu }}/unit
${{ppq}} total

Volume discounts:


{{added_to_cart_message}} View cart »

MG Sn63 / Pb37 Leaded Solder Paste - 35g Syringe
MG Part Number: 4860P-35G
Solder those tiny SMD components with ease using MG's 4860 Solder paste from Vetco Electronics. This solder paste comes in a 35g syringe and includes the syringe dispenser tip.

This is a No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of paste are non-conductive, noncorrosive and highly insulated. - no additional steps are required for post-soldering flux removal.

Features & Benefits:
  • Low residues
  • Easily dispensed
  • Excellent wettability
  • Hard non-conductive residues
After opening, store refrigerated between 2-10°C [35-50°F] to minimize solvent evaporation, flux separation, and chemical activity. Storage of syringes is preferred in an upright position with tip down to prevent flux separation and air entrapment. Use at room temperature, warm up can be achieved by removing from refrigerator 3 hours before use, faster warm up can also be achieved by placing in a sealed container in a water bath at near ambient temperature for 30 minutes. The shelf life of a refrigerated, unopened syringe is 6 months.

Paste Application:
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a dispensing application depends on viscosity, which can be altered by temperature change. If solder paste is purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.

Reusing Solder Paste:
This is not normally recommended, because it typically generates more problems than it is worth. If you do decide to reuse solder paste, these pointers may be helpful. This paste should be tightly sealed and refrigerated. Then, the paste may be reused at a later date, provided that the paste has not separated or thickened significantly compared to its original properties. Storage of syringes is preferred in an upright position with tip down to prevent flux separation and air entrapment.

MG4860P Sn63/Pb37
Shelf Life Unopened container (30-50°F/2-10°C) – 6 Months
Unopened container (68-77°F/20-25°C) – 1 Months
Opened container (68-77°F/20-25°C) – 24 Hours
Melting Point, °C 183 E
Hardness, Brinell 14HB
Coefficient of Thermal Expansion 24.7
Tensile Strength, psi 4442
Density, g/cc 8.42
Electrical Resistivity , (µohm- cm) 14.5
Electrical Conductivity, 104/ohm-cm 6.9
Yield Strength, psi 3950
Total Elongation,% 48
Joint Shear Strength, at 0.1mm/min 20 °C 23
Joint Shear Strength, at 0.1mm/min 100 °C 14
Creep Strength, N/mm2 at 0.1mm/min 20 °C 3.3
Property Specification TestMethod
Flux Classification REL0 JSTD-004
Copper Mirror No removal of copper film IPC-TM-650 2.3.32
Corrosion Pass IPC-TM-650 2.6.15
JSTD-004 2.44x1010ohms IPC-TM-650
Bellcore (Telecordia) 4.10x1010ohms Bellcore GR-78-CORE 13.1.3
Electromigration Pass Bellcore GR-78-CORE 13.1.4
Post Reflow Flux Residue 45% TGA Analysis
Acid Value 110 IPC-TM-650 2.3.13
Metal Loading 88% IPC-TM-650 2.2.20
Brookfield(1),kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified
Malcom(2),poise 850-1100 IPC-TM-650 modified
Slump Test
25 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35
150 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35
25 °C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35
150 °C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35
Solder Ball Test Pass IPC-TM-650 2.4.43
Initial 85 gm JIS Z 3284
Tack retention @ 24 hr 90 gm JIS Z 3284
Tack retention @ 24 hr 82 gm JIS Z 3284

Best results have been achieved when MG 4860P is reflowed in a forced air convection oven with a minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top & bottom).
The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e. density, thickness, etc.) determine the actual reflow profile.

QTY: 1 x MG Sn63 / Pb37 Leaded Solder Paste - No Clean - 35g Syringe
Product condition: New