MG Silicone Heat Transfer Compound - 5oz
MG Chemicals Part Number: 860-150G

Working with computer heatsinks or high power mosfets? - BUY THIS HEATSINK GREASE!

This heat transfer compound is designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:

• High thermal conductivity
• High dielectric constant
• High dissipation factor
• Use with heat sinks or metal chassis
• Will not dry or harden
• Contains zincs oxides and polydimenthyl siloxane

Specifications:

Physical Properties Test Method Silicone 860 Appearance Visual White paste Consistency ASTM D 217 Specific Gravity @ 25°C (77°F) 2.3 min Bleed % 24 hours @ 200°C FTM-321 2.0% max Evaporation 24 hours @ 200°C FTM-321 2.0% max Dropping Point ASTM D-566 > 500°F (260°C) Min. operating temp. 55°F/48°C Max. operating temp. 200°C (consistent) 300°C (intermittent) Electrical Properties Test Method Silicone 860 Thermal Conductivity in W/m·K (BTU in /(hr ft2 F) ) in W/m·K (BTU in /(hr ft2 F) ) 0.657 (4.56) Dielectric Strength (0.05l gap) ASTM D-149 400 V/MIL Dielectric Constant @ 1000 Hz 4.4 3.81 Dissipation Factor @ 1000 Hz ASTM D 150 0.0032 Resistivity @ 21°C ASTM D 150 1.5 x 1015 Ohm•cm

QTY: 1 x Tube of Silicone Heat Transfer Compound (150g / 5oz)