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Product Description

MG Silicone Heat Transfer Compound - 5oz
MG Chemicals Part Number: 860-150G

Working with computer heatsinks or high power mosfets? - BUY THIS HEATSINK GREASE!

This heat transfer compound is designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
  • High thermal conductivity
  • High dielectric constant
  • High dissipation factor
  • Use with heat sinks or metal chassis
  • Will not dry or harden
  • Contains zincs oxides and polydimenthyl siloxane
Specifications:
Physical Properties Test Method Silicone
860
Appearance Visual White paste
Consistency ASTM D 217
Specific Gravity
@ 25°C (77°F)		 2.3 min
Bleed %
24 hours @ 200°C		 FTM-321 2.0% max
Evaporation
24 hours @ 200°C		 FTM-321 2.0% max
Dropping Point ASTM D-566 > 500°F (260°C)
Min. operating temp. 55°F/48°C
Max. operating temp. 200°C (consistent)
300°C (intermittent)
Electrical Properties Test Method Silicone
860
Thermal Conductivity in W/m·K
(BTU in /(hr ft2 F) )		 in W/m·K
(BTU in /(hr ft2 F) )
0.657 (4.56)
Dielectric Strength
(0.05l gap)		 ASTM D-149 400 V/MIL
Dielectric Constant @ 1000 Hz 4.4 3.81
Dissipation Factor
@ 1000 Hz 		ASTM D 150 0.0032
Resistivity @ 21°C ASTM D 150 1.5 x 1015 Ohm•cm

QTY: 1 x Tube of Silicone Heat Transfer Compound (150g / 5oz)


Click here to read the California regulatory warning.