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Silicone Heat Transfer Compound (Heatsink Grease) - 4g
SKU: MG-860-4G
Silicone Heat Transfer Compound (Heatsink Grease) - 4g
MG Chemicals Part Number: 860-4G
As with most types of grease, a little bit goes a long way. In fact, this small 4 gram package is probably more than enough to cover several heatsinks.
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
QTY: 1 x 4g Packet of Silicone Heat Transfer Compound
MG Chemicals Part Number: 860-4G
As with most types of grease, a little bit goes a long way. In fact, this small 4 gram package is probably more than enough to cover several heatsinks.
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden
- Contains zincs oxides and polydimenthyl siloxane
| Physical Properties | Test Method | Silicone 860 |
|---|---|---|
| Appearance | Visual | White paste |
| Consistency | ASTM D 217 | --- |
| Specific Gravity @ 25°C (77°F) | 2.3 minimum | |
| Bleed % 24 hours @ 200°C | FTM-321 | 2.0% maximum |
| Evaporation 24 hours @ 200°C | FTM-321 | 2.0% maximum |
| Dropping Point | ASTM D-566 | >260 °C [>500 °F] |
| Min. operating temp. | 55°F/48°C | |
| Max. operating temp. | 200°C (consistent) 300°C (intermittent) | |
| Electrical Properties | Test Method | Silicone 860 |
| Thermal Conductivity | Hot Wire Method Heat Flow #36°C | in W/m·K (BTU in /(hr ft2 F)) |
| 0.657 (4.56) | ||
| Dielectric Strength (0.05l gap) | ASTM D-149 | 400 V/mil |
| Dielectric Constant @ 1000 Hz | ASTM D- 150 | 3.81 |
| Dissipation Factor @ 1000 Hz | ASTM D 150 | 0.0032 |
| Resistivity @ 21°C | ASTM D 150 | 1.5 x 1015 Ohm•cm |
QTY: 1 x 4g Packet of Silicone Heat Transfer Compound
Silicone Heat Transfer Compound (Heatsink Grease) - 4g
MG Chemicals Part Number: 860-4G
As with most types of grease, a little bit goes a long way. In fact, this small 4 gram package is probably more than enough to cover several heatsinks.
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
QTY: 1 x 4g Packet of Silicone Heat Transfer Compound
MG Chemicals Part Number: 860-4G
As with most types of grease, a little bit goes a long way. In fact, this small 4 gram package is probably more than enough to cover several heatsinks.
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden
- Contains zincs oxides and polydimenthyl siloxane
| Physical Properties | Test Method | Silicone 860 |
|---|---|---|
| Appearance | Visual | White paste |
| Consistency | ASTM D 217 | --- |
| Specific Gravity @ 25°C (77°F) | 2.3 minimum | |
| Bleed % 24 hours @ 200°C | FTM-321 | 2.0% maximum |
| Evaporation 24 hours @ 200°C | FTM-321 | 2.0% maximum |
| Dropping Point | ASTM D-566 | >260 °C [>500 °F] |
| Min. operating temp. | 55°F/48°C | |
| Max. operating temp. | 200°C (consistent) 300°C (intermittent) | |
| Electrical Properties | Test Method | Silicone 860 |
| Thermal Conductivity | Hot Wire Method Heat Flow #36°C | in W/m·K (BTU in /(hr ft2 F)) |
| 0.657 (4.56) | ||
| Dielectric Strength (0.05l gap) | ASTM D-149 | 400 V/mil |
| Dielectric Constant @ 1000 Hz | ASTM D- 150 | 3.81 |
| Dissipation Factor @ 1000 Hz | ASTM D 150 | 0.0032 |
| Resistivity @ 21°C | ASTM D 150 | 1.5 x 1015 Ohm•cm |
QTY: 1 x 4g Packet of Silicone Heat Transfer Compound