This Medium Cure, 2-part Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

This thermal epoxy is great for heat sink bonding. It is perfect for use as a high-powered LED adhesive, for gluing LEDs to heat sinks.
Features:

• Excellent 1.36 W/(m•K) thermal conductivity
• Easy 1:1 mix ratio
• Adheres to most electronic substrates
• Stores and ships at slightly below room temperature — no freezing or dry ice required
• Very long shelf life of at least two years — even when stored at room temperature
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

Specification	Test Method	Result
Physical Properties - Cured
Color	Visual	Dark Grey
Density		2.30 g/cm3
(Shore D durometer)	76-77D
Tensile Strength	ASTM-D-638	10 N/mm2 [1,400 lb/in2]
Young’s Modulus	ASTM-D-638	—
Elongation	ASTM-D-638	1.8%
Compression Strength	ASTM-D-695	34 N/mm2 [4,900 lb/in2]
Lap Shear Strength (Aluminum 5052)	ASTM-D-695	8.2 N/mm2 [8,200 lb/in2]
Water Absorption	ASTM D 570	0.35%
Outgassing (Total Mass Loss) @ 24 h	ASTM E 595	3.54%
Water Vapor Release (WVR)	ASTM E 595	0.15%
Collectable Volatile Condensable Material	ASTM E 595	0.18%
Electrical Properties - Cured
Breakdown Voltage @4.188 mm	ASTM D 149	29.0 kV
Dielectric Strength @4.188 mm	ASTM D 149	6.5 kV/mm [164 V/mil]
Breakdown Voltage @3.175 mm [1/8”]	Reference fit	24.3 kV
Dielectric Strength @3.175 mm [1/8”]		7.7 kV/mm [195 V/mil]
Volume Resistivity	ASTM D 257	9 x1012 Ω · cm
Surface Resistivity	ASTM D 257	3 x1013Ω
Dielectric Dissipation & Constant		dissipation, D constant, k’
Dissipation & Constant @ 1 kHz	ASTM D 150-98	0.025 , 5.43
Insulating		Yes
Conductive		No
Thermal Properties - Cured
Thermal Conductivity	ASTM E	1461
	@ 25°C @ 50°C @ 100°C	1.36 W/(m·K) 1.34 W/(m·K) 1.28 W/(m·K)
Heat Deflection Temperature	ASTM D 648	42 °C [115 °F]
Glass Transition Temperature (Tg)	ASTM D 3418	46 °C [108 °F]
CTE prior Tg	ASTM E 831	71 ppm/°C
CTE after Tg	ASTM E 831	131 ppm/°C
Specific Heat @25 °C [77 °F]	ASTM E 831	0.907 J/(g∙K)
Curing & Work Schedule
Working Life		45 min
Shelf Life		≥2 y
Min. Service Cure		7 h
Full Cure @25 °C [77 °F]		24 h
Full Cure @65 °C [149 °F]		60 min
Temperature Service Range
Constant Service Temperature		-65 °C to 165 °C [-85 °F to 329 °F]
Maximum Withstand Temperature		-70 °C to 200 °C [-94 °F to 392 °F]
Storage Temperature of Unmixed Parts		22 °C to 27 °C [72 °F to 81 °F]

Properties of Uncured 8329TCM
Physical Properties - Uncured	Mixture (1A:1B)
Color	Dark Grey
Density	2.43 g/mL
Mix Ratio by volume (A:B)	1:00:1.00
Mix Ratio by weight (A:B)	0.93:1.00
Solids Content (w/w)	100%
Physical Properties - Uncured	Part A	Part B
Color	Dark Grey	Dark Grey
Density	2.485 g/mL	2.38 g/mL
Flash Point	>149 °C [300 °F]	>148 °C [298 °F]
Viscosity	1,300,000 cP [1,300 Pažs]	6,000,000 cP [6,000 Pažs]