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This Medium Cure, 2-part Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

This thermal epoxy is great for heat sink bonding. It is perfect for use as a high-powered LED adhesive, for gluing LEDs to heat sinks.
Features:
  • Excellent 1.36 W/(m•K) thermal conductivity
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature — no freezing or dry ice required
  • Very long shelf life of at least two years — even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons


Specification Test Method Result
Physical Properties - Cured
Color Visual Dark Grey
Density 2.30 g/cm3
(Shore D durometer) 76-77D
Tensile Strength ASTM-D-638 10 N/mm2 [1,400 lb/in2]
Young’s Modulus ASTM-D-638
Elongation ASTM-D-638 1.8%
Compression Strength ASTM-D-695 34 N/mm2 [4,900 lb/in2]
Lap Shear Strength (Aluminum 5052) ASTM-D-695 8.2 N/mm2 [8,200 lb/in2]
Water Absorption ASTM D 570 0.35%
Outgassing (Total Mass Loss) @ 24 h ASTM E 595 3.54%
Water Vapor Release (WVR) ASTM E 595 0.15%
Collectable Volatile Condensable Material ASTM E 595 0.18%
Electrical Properties - Cured
Breakdown Voltage @4.188 mm ASTM D 149 29.0 kV
Dielectric Strength  @4.188 mm ASTM D 149 6.5 kV/mm [164 V/mil]
Breakdown Voltage @3.175 mm [1/8”] Reference fit 24.3 kV
Dielectric Strength  @3.175 mm [1/8”]   7.7 kV/mm [195 V/mil]
Volume Resistivity ASTM D 257 9 x1012 Ω · cm
Surface Resistivity ASTM D 257 3 x1013Ω
Dielectric Dissipation & Constant   dissipation, D constant, k’
Dissipation & Constant @ 1 kHz ASTM D 150-98 0.025 , 5.43
Insulating   Yes
Conductive   No
Thermal Properties - Cured
Thermal Conductivity ASTM E 1461
  @ 25°C
@ 50°C
@ 100°C
1.36 W/(m·K)
1.34 W/(m·K)
1.28 W/(m·K)
Heat Deflection Temperature ASTM D 648 42 °C [115 °F]
Glass Transition Temperature (Tg) ASTM D 3418 46 °C [108 °F]
CTE prior Tg ASTM E 831 71 ppm/°C
CTE after Tg ASTM E 831 131 ppm/°C
Specific Heat @25 °C [77 °F] ASTM E 831 0.907 J/(g∙K)
Curing & Work Schedule
Working Life 45 min
Shelf Life ≥2 y
Min. Service Cure 7 h
Full Cure @25 °C [77 °F] 24 h
Full Cure @65 °C [149 °F] 60 min
Temperature Service Range
Constant Service Temperature -65 °C to 165 °C
[-40 °F to 302 °F]
 Maximum Withstand Temperature -70 °C to 200 °C
[-40 °F to 302 °F]
Storage Temperature of Unmixed Parts 22 °C to 27 °C
[72 °F to 81 °F]
Properties of Uncured 8329TCM
Physical Properties - Uncured Mixture (1A:1B)
Color Dark Grey
Density 2.43 g/mL
Mix Ratio by volume (A:B) 1:00:1.00
Mix Ratio by weight (A:B) 0.93:1.00
Solids Content (w/w) 100%
Physical Properties - Uncured Part A Part B
Color Dark Grey Dark Grey
Density 2.485 g/mL 2.38 g/mL
Flash Point >149 °C [300 °F] >148 °C [298 °F]
Viscosity 1,300,000 cP [1,300 Pažs] 6,000,000 cP [6,000 Pažs]
Product condition: New